DocumentCode
3400751
Title
Spectroscopic approach to determine shrink temperature and duration for heat shrinkable components
Author
Ganga, S. ; Suryanarayana, K. ; Sudhindra, A. ; Thamb, V. Asai
Author_Institution
Central Power Res. Inst., Bangalore, India
fYear
2009
fDate
19-23 July 2009
Firstpage
109
Lastpage
112
Abstract
Heat shrinkable type is one among the other jointing systems which is used to maintain the continuity of cable especially for long length of cable requirements. In this type, the component shrinks/recovers to its original size (unilateral direction) when heated in an unconstrained state. The technology of low shrink temperature allows the tubing to shrink rapidly thereby minimizing heat exposure. The temperature initially used for expansion/stretch has a significant bearing on the shrink temperature. The heat shrinkable component might shrink differently for different shrink temperatures and duration selected in the shrinking process. Since failure of heat shrinkable component in service can lead to serious consequences, it is desirable to know the effect of improper shrink temperature on the components. The paper discusses the effect of improper selection of, temperature and its duration of application, in the shrink process for stress control, insulating and anti track tubing samples. The study, at microscopic level indicated that improper supply of heat and duration results in incomplete recovery of the component. Also there is formation of internal defects viz., micro voids, clevages, surface delaminations, formation of weak links and poor interfaces between conductor and heat shrinkable component.
Keywords
cable jointing; heat treatment; shrinkage; surface morphology; cable continuity; heat shrinkable components; jointing systems; shrink temperature; Conducting materials; Crystalline materials; Crystallization; Heat recovery; Heating; Insulation life; Microscopy; Spectroscopy; Stress control; Temperature; Expanded state; Heat shrinkable; Unconstrained state; crystalline melt temperature; incomplete recovery;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location
Harbin
Print_ISBN
978-1-4244-4367-3
Electronic_ISBN
978-1-4244-4368-0
Type
conf
DOI
10.1109/ICPADM.2009.5252493
Filename
5252493
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