• DocumentCode
    3400751
  • Title

    Spectroscopic approach to determine shrink temperature and duration for heat shrinkable components

  • Author

    Ganga, S. ; Suryanarayana, K. ; Sudhindra, A. ; Thamb, V. Asai

  • Author_Institution
    Central Power Res. Inst., Bangalore, India
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    109
  • Lastpage
    112
  • Abstract
    Heat shrinkable type is one among the other jointing systems which is used to maintain the continuity of cable especially for long length of cable requirements. In this type, the component shrinks/recovers to its original size (unilateral direction) when heated in an unconstrained state. The technology of low shrink temperature allows the tubing to shrink rapidly thereby minimizing heat exposure. The temperature initially used for expansion/stretch has a significant bearing on the shrink temperature. The heat shrinkable component might shrink differently for different shrink temperatures and duration selected in the shrinking process. Since failure of heat shrinkable component in service can lead to serious consequences, it is desirable to know the effect of improper shrink temperature on the components. The paper discusses the effect of improper selection of, temperature and its duration of application, in the shrink process for stress control, insulating and anti track tubing samples. The study, at microscopic level indicated that improper supply of heat and duration results in incomplete recovery of the component. Also there is formation of internal defects viz., micro voids, clevages, surface delaminations, formation of weak links and poor interfaces between conductor and heat shrinkable component.
  • Keywords
    cable jointing; heat treatment; shrinkage; surface morphology; cable continuity; heat shrinkable components; jointing systems; shrink temperature; Conducting materials; Crystalline materials; Crystallization; Heat recovery; Heating; Insulation life; Microscopy; Spectroscopy; Stress control; Temperature; Expanded state; Heat shrinkable; Unconstrained state; crystalline melt temperature; incomplete recovery;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252493
  • Filename
    5252493