DocumentCode
3400770
Title
Effect of modifier TMPTMA on electrical properties of cured epoxy system for V.P.I. resin
Author
Duan, Jingkuan ; Kim, Chonung ; Jiang, Pingkai ; Liu, Fei ; Wang, Genlin ; Zhang, Jun ; Huang, Xingyi
Author_Institution
Dept. of Polymer Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
fYear
2009
fDate
19-23 July 2009
Firstpage
113
Lastpage
116
Abstract
V.P.I. is the most advanced impregnation technology for the electrical machines that have been developed. With the rapid development of the electrical industry, demands of improving the properties of V.P.I. resins become higher and higher. It is of practical significance to investigate the effect of the modification of the epoxy resin TMPTMA on the cross-linking structure, the DC electrical resistivity and dielectric breakdown characteristics of the cured epoxide for V.P.I. insulation. This paper aims to explore the effect of TMPTMA concentration on the temperature dependence of the DC resistivity of the cured system and to study the dielectric breakdown behaviors of the cured systems with different TMPTMA concentrations. The modification of the epoxy resin by TMPTMA has been found to surely provide the possibility for improving the density of the cross-linking structures, electrical properties and thermal stability for V.P.I. resin based on the epoxy resin.
Keywords
electric breakdown; electric machines; polymers; DC electrical resistivity; cross-linking structure; cured epoxy system; dielectric breakdown characteristic; electrical industry; electrical machines; electrical properties; epoxy resin; Chemicals; Conductivity; Curing; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electrical resistance measurement; Epoxy resins; Temperature dependence; Testing; V.P.I.; dielectric breakdown; resistivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location
Harbin
Print_ISBN
978-1-4244-4367-3
Electronic_ISBN
978-1-4244-4368-0
Type
conf
DOI
10.1109/ICPADM.2009.5252494
Filename
5252494
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