• DocumentCode
    3400770
  • Title

    Effect of modifier TMPTMA on electrical properties of cured epoxy system for V.P.I. resin

  • Author

    Duan, Jingkuan ; Kim, Chonung ; Jiang, Pingkai ; Liu, Fei ; Wang, Genlin ; Zhang, Jun ; Huang, Xingyi

  • Author_Institution
    Dept. of Polymer Sci. & Eng., Shanghai Jiao Tong Univ., Shanghai, China
  • fYear
    2009
  • fDate
    19-23 July 2009
  • Firstpage
    113
  • Lastpage
    116
  • Abstract
    V.P.I. is the most advanced impregnation technology for the electrical machines that have been developed. With the rapid development of the electrical industry, demands of improving the properties of V.P.I. resins become higher and higher. It is of practical significance to investigate the effect of the modification of the epoxy resin TMPTMA on the cross-linking structure, the DC electrical resistivity and dielectric breakdown characteristics of the cured epoxide for V.P.I. insulation. This paper aims to explore the effect of TMPTMA concentration on the temperature dependence of the DC resistivity of the cured system and to study the dielectric breakdown behaviors of the cured systems with different TMPTMA concentrations. The modification of the epoxy resin by TMPTMA has been found to surely provide the possibility for improving the density of the cross-linking structures, electrical properties and thermal stability for V.P.I. resin based on the epoxy resin.
  • Keywords
    electric breakdown; electric machines; polymers; DC electrical resistivity; cross-linking structure; cured epoxy system; dielectric breakdown characteristic; electrical industry; electrical machines; electrical properties; epoxy resin; Chemicals; Conductivity; Curing; Dielectric breakdown; Dielectric materials; Dielectrics and electrical insulation; Electrical resistance measurement; Epoxy resins; Temperature dependence; Testing; V.P.I.; dielectric breakdown; resistivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
  • Conference_Location
    Harbin
  • Print_ISBN
    978-1-4244-4367-3
  • Electronic_ISBN
    978-1-4244-4368-0
  • Type

    conf

  • DOI
    10.1109/ICPADM.2009.5252494
  • Filename
    5252494