DocumentCode :
3400793
Title :
Computer simulation and analysis of electric and temperature fields of HVDC cables
Author :
Wang, Qiaohua ; Li, Xuguang ; Yin, Yi
Author_Institution :
Dept. of Electr. Eng., Shanghai Jiao Tong Univ., Shanghai, China
fYear :
2009
fDate :
19-23 July 2009
Firstpage :
101
Lastpage :
104
Abstract :
HVDC cables play a more and more important role in interconnecting national grids and HVDC flexible power system. This paper deals with the calculation of electric and temperature fields in HVDC cables. The calculation of electric and temperature in an HVDC cables is far more complex than the equivalent case in AC cables. This is due to the fact that the conductivity of the cable insulation materials is temperature and field dependent, due to this fact that electric fields under dc voltage may be time-dependent. The field distribution in an HVDC cable may be of a capacitive or resistive nature. Electric field distribution is also influenced by temperature field. This even may lead to an instability that causes breakdown of the cable. The calculation and analysis of the temperature field distribution and its influence on the electric fields is carried out.
Keywords :
electric fields; electrical conductivity; power cable insulation; transmission line theory; AC cables; HVDC cables; HVDC flexible power system; breakdown; cable insulation materials; electric fields; field distribution; interconnecting national grids; temperature fields; Cable insulation; Computer simulation; Conductivity; Dielectrics and electrical insulation; Electric fields; HVDC transmission; Power system analysis computing; Power system interconnection; Power system simulation; Temperature distribution; HVDC cable; computer simulation; electric field; temperature field;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Properties and Applications of Dielectric Materials, 2009. ICPADM 2009. IEEE 9th International Conference on the
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-4367-3
Electronic_ISBN :
978-1-4244-4368-0
Type :
conf
DOI :
10.1109/ICPADM.2009.5252495
Filename :
5252495
Link To Document :
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