Title :
Coplanarity measurements of electronic-components during soldering
Author_Institution :
Centre of Microtechnical Manuf., Tech. Univ. Dresden, Dresden, Germany
Abstract :
The coplanarity between the substrate (or printed board) and the SMD-package is a very important characteristic. This coplanarity depends on the warpage of the board and the package. An insufficient coplanarity can lead to open solder joints and/or bridges of the solder joints. Additional mechanical stress (especially in z-direction) inside of the solder joints may also occur. The warpages of the packages and the boards change during a soldering process. The Thermoire®-measurement gives the possibility to control the warpage under soldering conditions.
Keywords :
printed circuits; soldering; surface mount technology; SMD-package; Thermoire-measurement; coplanarity measurement; electronic component; mechanical stress; printed board; solder joint; soldering; warpage; Soldering;
Conference_Titel :
Design and Technology of Electronics Packages, (SIITME) 2009 15th International Symposium for
Conference_Location :
Gyula
Print_ISBN :
978-1-4244-5132-6
Electronic_ISBN :
978-1-4244-5133-3
DOI :
10.1109/SIITME.2009.5407405