Optical interconnect module extensible to 10,000 parallel channels for a smart-pixel optical backplane

Author

Goodwill, D.J. ; Hinton, H.S.

Author_Institution

Dept. of Electr. & Comput. Eng., Colorado Univ., Boulder, CO, USA

fYear

1996

fDate

5-9 Aug. 1996

Firstpage

61

Lastpage

62

Abstract

A set of optics suitable for interconnecting and powering reflective hybrid-SEEDs in a free-space optical backplane has been presented. Detailed design has been conducted to demonstrate that the optics meet the constraints both of required performance, and of available fabrication. The design process has shown that with given hybrid-SEED design rules a smart pixel density of 515/cm/sup 2/ can be supported on a 1 cm/sup 2/ chip.

Keywords

SEEDs; electro-optical modulation; electro-optical switches; optical design techniques; optical elements; optical fabrication; optical interconnections; optical polarisers; smart pixels; 200 Mbit/s; available fabrication; design process; free-space optical backplane; hybrid-SEED design rules; optical interconnect module; optics; parallel channels; reflective hybrid-SEEDs; required performance; smart pixel density; smart-pixel optical backplane; Backplanes; Integrated optics; Lenses; Microoptics; Optical arrays; Optical interconnections; Optical modulation; Optical receivers; Optical transmitters; Smart pixels;

fLanguage

English

Publisher

ieee

Conference_Titel

Advanced Applications of Lasers in Materials Processing/Broadband Optical Networks/Smart Pixels/Optical MEMs and Their Applications. IEEE/LEOS 1996 Summer Topical Meetings:

Conference_Location

Keystone, CO, USA

Print_ISBN

0-7803-3175-3

Type

conf

DOI

10.1109/LEOSST.1996.540745

Filename

540745