Trends in MEMS technology

Author

Ristic, Ljubisa ; Shah, Mahesh

Author_Institution

Sensor Product Div., Motorola Inc., Phoenix, AZ, USA

fYear

1996

fDate

22-24 Oct 1996

Firstpage

64

Lastpage

72

Abstract

Interest in MEMS (micro electro mechanical systems) has grown dramatically in the last decade because of a wide range of applications. These include the automotive industry, process control and automation, scientific and medical instrumentation, telecommunication, commodity products, environmental monitoring, etc. As a result, MEMS technology has become one of the most rapidly changing fields today. This paper reviews basic aspects of current MEMS technology focusing on bulk micromachining, surface micromachining, wafer bonding, and MEMS packaging, including the examples of devices made in the specific technologies. Also, some comments on future integrated MEMS are included

Keywords

elemental semiconductors; integrated circuit packaging; micromachining; micromechanical devices; silicon; EEPROM; MEMS packaging; MEMS technology; Si; automation; automotive industry; bulk micromachining; commodity products; environmental monitoring; integrated MEMS devices; medical instrumentation; micro electro mechanical system; process control; surface micromachining; telecommunication; wafer bonding; Automation; Automotive engineering; Communication industry; Electrical equipment industry; Industrial control; Instruments; Mechanical systems; Micromachining; Micromechanical devices; Process control;

fLanguage

English

Publisher

ieee

Conference_Titel

WESCON/96

Conference_Location

Anaheim, CA

ISSN

1095-791X

Print_ISBN

0-7803-3274-1

Type

conf

DOI

10.1109/WESCON.1996.553965

Filename

553965