• DocumentCode
    340168
  • Title

    Preparation and characterization of InGaAs quantum wires on V-groove patterned InP

  • Author

    Schrimpf, T. ; Piester, D. ; Wehmann, H.-H. ; Bonsch, P. ; Wullner, D. ; Schlachetzki, A. ; Mendorf, C. ; Lakner, H.

  • Author_Institution
    Inst. fur Halbleitertech., Tech. Univ. Braunschweig, Germany
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    507
  • Lastpage
    510
  • Abstract
    We report on the characterization of InGaAs quantum wells (QWL) and wires (QWR) on V-groove patterned InP substrates. The quality of the QWL on the (100)-surface between the grooves is discussed concerning different sample preparation methods. The material composition and the thickness of these QWL is determined. The geometrical shape of the QWR in the tip of the V-grooves is measured by atomic-force microscopy (AFM) and compared with transmission-electron microscopy (TEM). The dependence of the QWR photoluminescence (PL) on sample temperature is studied
  • Keywords
    III-V semiconductors; MOCVD; atomic force microscopy; gallium arsenide; indium compounds; photoluminescence; semiconductor growth; semiconductor quantum wells; semiconductor quantum wires; transmission electron microscopy; vapour phase epitaxial growth; (100)-surface; AFM; InGaAs; InGaAs quantum wells; InGaAs quantum wires; InP; MOVPE; TEM; V-groove patterned InP; atomic-force microscopy; characterization; geometrical shape; material composition; photoluminescence; preparation; sample preparation methods; sample temperature; transmission-electron microscopy; Atomic force microscopy; Atomic measurements; Composite materials; Indium gallium arsenide; Indium phosphide; Photoluminescence; Shape measurement; Temperature dependence; Transmission electron microscopy; Wires;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 1999. IPRM. 1999 Eleventh International Conference on
  • Conference_Location
    Davos
  • ISSN
    1092-8669
  • Print_ISBN
    0-7803-5562-8
  • Type

    conf

  • DOI
    10.1109/ICIPRM.1999.773744
  • Filename
    773744