• DocumentCode
    3401680
  • Title

    Exploiting Environmental Properties for Wireless Localization and Location Aware Applications

  • Author

    Chen, Shu ; Chen, Yingying ; Trappe, Wade

  • Author_Institution
    Wireless Inf. Network Lab., Rutgers Univ., North Brunswick, NJ
  • fYear
    2008
  • fDate
    17-21 March 2008
  • Firstpage
    90
  • Lastpage
    99
  • Abstract
    Wireless sensor networks monitor phenomena that vary over the spatial region the sensor network covers. The sensor readings may also be dual-used for additional purposes. In this paper we propose to use the inherent spatial variability in physical phenomena to support localization and position verification. We first present the problem of localization using general spatial information fields, and then propose a theory for exploiting this spatial variability for localization. Our spatio-correlation weighting mechanism (SCWM) uses spatial relationships of measured physical phenomena to determine an appropriate subset of environmental parameters for better location accuracy. We next present the Flex - EP algorithm, which supports our theoretical model for performing localization. Finally, we provide an experimental evaluation of our approach by using a collection of physical phenomena measured across one hundred locations inside a building. Our results provide strong evidence of the viability of using general sensor readings for location applications.
  • Keywords
    wireless sensor networks; location aware applications; position verification; spatio-correlation weighting mechanism; wireless localization; wireless sensor networks monitor; Acoustic sensors; Application software; Base stations; Computer networks; Condition monitoring; Databases; Pervasive computing; Sensor phenomena and characterization; Temperature sensors; Wireless sensor networks; environmental parameters; sensor networks; wireless localization;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Pervasive Computing and Communications, 2008. PerCom 2008. Sixth Annual IEEE International Conference on
  • Conference_Location
    Hong Kong
  • Print_ISBN
    978-0-7695-3113-7
  • Type

    conf

  • DOI
    10.1109/PERCOM.2008.65
  • Filename
    4517382