Title :
Three dimensional IC´s and an application to high speed image processor
Author :
Taniguchi, Kenji
Author_Institution :
VLSI Research Center, Toshiba Corporation Komukai, Toshiba-cho, Saiwai-ku, Kawasaki, 210 Japan
Abstract :
Present state-of-the-art 3-D IC fabrication technologies are reviewed. Both short interconnection wiring inherent to 3-D structure and parallel processing architecture offer high performance for 3-D integrated circuit. An idea of a high speed image sensor composed of six layers is proposed.
Keywords :
Arrays; Integrated circuit interconnections; Optical sensors; Parallel processing; Wiring;
Conference_Titel :
Computer Arithmetic (ARITH), 1985 IEEE 7th Symposium on
Conference_Location :
Urbana, IL,
DOI :
10.1109/ARITH.1985.6158975
