DocumentCode
3401966
Title
Three dimensional IC´s and an application to high speed image processor
Author
Taniguchi, Kenji
Author_Institution
VLSI Research Center, Toshiba Corporation Komukai, Toshiba-cho, Saiwai-ku, Kawasaki, 210 Japan
fYear
1985
fDate
4-6 June 1985
Firstpage
216
Lastpage
222
Abstract
Present state-of-the-art 3-D IC fabrication technologies are reviewed. Both short interconnection wiring inherent to 3-D structure and parallel processing architecture offer high performance for 3-D integrated circuit. An idea of a high speed image sensor composed of six layers is proposed.
Keywords
Arrays; Integrated circuit interconnections; Optical sensors; Parallel processing; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer Arithmetic (ARITH), 1985 IEEE 7th Symposium on
Conference_Location
Urbana, IL,
Type
conf
DOI
10.1109/ARITH.1985.6158975
Filename
6158975
Link To Document