A highly integrated 3D millimeter-wave filter using LTCC system-on-package (SOP) technology for V-band WLAN gigabit wireless systems

Author

Lee, J.-H. ; Kidera, N. ; Pinel, S. ; Papapolymerou, J. ; Laskar, J. ; Tentzeris, M.M.

Author_Institution

Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA

Volume

1

fYear

2005

fDate

4-7 Dec. 2005

Abstract

In this paper, the development of highly integrated three-dimensional (3D) filter solutions in multilayer low temperature cofired ceramic (LTCC) technologies is presented for millimeter-wave (mmW) compact, low-cost wireless front-end modules utilizing system-on-package (SOP) technology. These stacked-cavity embedded filters demonstrate an excellent performance (IL < 2.37 dB, 3-dB BW ∼ 3.5 % at the center frequency of 57.3 GHz) and great potential for high level of 3D integration potential. The slot-coupled cavity filters have been realized by vertically stacking three identical cavity resonators employing rows of vias as sidewalls, thus representing a new class of devices that enable the 3D integration for V-band WLAN gigabit wireless systems.

Keywords

cavity resonators; ceramic packaging; millimetre wave filters; system-in-package; wireless LAN; 3D millimeter-wave filter; 57.3 GHz; LTCC system-on-package technology; V-band WLAN; cavity resonators; gigabit wireless systems; low temperature cofired ceramic; slot-coupled cavity filters; stacked-cavity embedded filters; Band pass filters; Cavity resonators; Frequency; Microstrip resonators; Millimeter wave communication; Millimeter wave technology; Nonhomogeneous media; Resonator filters; Stacking; Wireless LAN;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings

Print_ISBN

0-7803-9433-X

Type

conf

DOI

10.1109/APMC.2005.1606286

Filename

1606286