DocumentCode
3402831
Title
The comparative study on thermal performance and life time of liquid cooling LED bulb lamp and traditional LED bulb lamp
Author
Chong Zhou ; Weimin Chen ; Xianming Liu ; Wei Lai ; Xingfu Cheng ; Ye Xiaoguang
Author_Institution
Key Lab. for Opto-Electron. Technol. & Syst., Chongqing Univ., Chongqing, China
fYear
2013
fDate
10-12 Nov. 2013
Firstpage
122
Lastpage
124
Abstract
LED bulb lamp dissipates its heat through the metal heat sink. There are two defects, the bad thermal performance and the high price. Then the liquid cooling LED bulb lamp is proposed. But there is little research about its thermal performance and life time. The objective of this paper is to compare thermal performance and life time between liquid cooling LED bulb lamp and the traditional LED bulb lamp with metal heat sink. The transient and steady temperature characteristics of these two lamps are simulated with finite element analysis software, the temperature variation curves and simulating steady temperature fields are acquired, and the life time is estimated over the life cycle expression. The result shows that the junction temperature of liquid cooling lamp is 40°C lower and the theoretical life time is 6.28 times longer than the traditional LED lamp at 3 Watt. The rising rate of junction temperature of liquid cooling LED lamp is slower. The liquid cooling structure is more reasonable and the life is longer.
Keywords
LED lamps; cooling; finite element analysis; heat sinks; finite element analysis software; heat dissipation; junction temperature; liquid cooling LED bulb lamp life time; liquid cooling LED bulb lamp thermal performance; metal heat sink; steady temperature characteristics; temperature variation curve; traditional LED bulb lamp life time; traditional LED bulb lamp thermal performance; transient temperature characteristics; Aluminum; Copper; Gallium nitride; Glass; Liquids; Periodic structures; Welding;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid State Lighting (ChinaSSL), 2013 10th China International Forum on
Conference_Location
Beijing
Print_ISBN
978-1-4799-2249-9
Type
conf
DOI
10.1109/SSLCHINA.2013.7177329
Filename
7177329
Link To Document