• DocumentCode
    3403297
  • Title

    Squeezing maximizing performance out of 3D cache-stacked multicore architectures

  • Author

    Khan, Ajmal ; Kyungsu Kang ; Chong-Min Kyung

  • Author_Institution
    Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
  • fYear
    2011
  • fDate
    7-10 Aug. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    3D integration is one of the most promising options to fulfill the demands of high performance and large cache by integrating multiple processor cores and 3D stacked cache. There are however temperature problems in 3D integration. This paper presents a method for performance maximization of a 3D cache-stacked multicore system keeping the temperature under a given limit while by assigning the clock frequencies and number of cache banks to each core according to the requirement. We have done experiments on multiple benchmark programs and have found a peak 32% and an average 29.8% improvement in performance as compared to the base case which assigns the same frequency and the same number of banks to each core.
  • Keywords
    cache storage; multiprocessing systems; three-dimensional integrated circuits; 3D cache-stacked multicore architectures; benchmark programs; cache banks; clock frequencies; multiple processor cores; performance maximization; squeezing maximizing performance; temperature problems; Barium; Monitoring; Temperature measurement; Temperature sensors; Three dimensional displays; 3D Integrated Circuits; Instructions per second; Non uniform Cache; Temperature management;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on
  • Conference_Location
    Seoul
  • ISSN
    1548-3746
  • Print_ISBN
    978-1-61284-856-3
  • Electronic_ISBN
    1548-3746
  • Type

    conf

  • DOI
    10.1109/MWSCAS.2011.6026350
  • Filename
    6026350