Title :
Squeezing maximizing performance out of 3D cache-stacked multicore architectures
Author :
Khan, Ajmal ; Kyungsu Kang ; Chong-Min Kyung
Author_Institution :
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Abstract :
3D integration is one of the most promising options to fulfill the demands of high performance and large cache by integrating multiple processor cores and 3D stacked cache. There are however temperature problems in 3D integration. This paper presents a method for performance maximization of a 3D cache-stacked multicore system keeping the temperature under a given limit while by assigning the clock frequencies and number of cache banks to each core according to the requirement. We have done experiments on multiple benchmark programs and have found a peak 32% and an average 29.8% improvement in performance as compared to the base case which assigns the same frequency and the same number of banks to each core.
Keywords :
cache storage; multiprocessing systems; three-dimensional integrated circuits; 3D cache-stacked multicore architectures; benchmark programs; cache banks; clock frequencies; multiple processor cores; performance maximization; squeezing maximizing performance; temperature problems; Barium; Monitoring; Temperature measurement; Temperature sensors; Three dimensional displays; 3D Integrated Circuits; Instructions per second; Non uniform Cache; Temperature management;
Conference_Titel :
Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on
Conference_Location :
Seoul
Print_ISBN :
978-1-61284-856-3
Electronic_ISBN :
1548-3746
DOI :
10.1109/MWSCAS.2011.6026350