DocumentCode
3403297
Title
Squeezing maximizing performance out of 3D cache-stacked multicore architectures
Author
Khan, Ajmal ; Kyungsu Kang ; Chong-Min Kyung
Author_Institution
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
fYear
2011
fDate
7-10 Aug. 2011
Firstpage
1
Lastpage
4
Abstract
3D integration is one of the most promising options to fulfill the demands of high performance and large cache by integrating multiple processor cores and 3D stacked cache. There are however temperature problems in 3D integration. This paper presents a method for performance maximization of a 3D cache-stacked multicore system keeping the temperature under a given limit while by assigning the clock frequencies and number of cache banks to each core according to the requirement. We have done experiments on multiple benchmark programs and have found a peak 32% and an average 29.8% improvement in performance as compared to the base case which assigns the same frequency and the same number of banks to each core.
Keywords
cache storage; multiprocessing systems; three-dimensional integrated circuits; 3D cache-stacked multicore architectures; benchmark programs; cache banks; clock frequencies; multiple processor cores; performance maximization; squeezing maximizing performance; temperature problems; Barium; Monitoring; Temperature measurement; Temperature sensors; Three dimensional displays; 3D Integrated Circuits; Instructions per second; Non uniform Cache; Temperature management;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on
Conference_Location
Seoul
ISSN
1548-3746
Print_ISBN
978-1-61284-856-3
Electronic_ISBN
1548-3746
Type
conf
DOI
10.1109/MWSCAS.2011.6026350
Filename
6026350
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