Title :
Wavelength multiplexers by cascading 3D vertical couplers
Author :
Liu, Bin ; Shakouri, Ali ; Abraham, P. ; Bowers, John E.
Author_Institution :
Dept. of Electr. & Comput. Eng., California Univ., Santa Barbara, CA, USA
Abstract :
Increasing integration density is a key factor to reduce cost and improve performance in optoelectronic circuits. We demonstrate a wavelength multiplexer by cascading strongly coupled 3D vertical couplers using wafer fusion and a double-sided processing technique
Keywords :
integrated optoelectronics; multiplexing equipment; optical couplers; wafer bonding; wavelength division multiplexing; cascading; double-sided processing technique; integration density; optoelectronic circuits; strongly coupled 3D vertical couplers; wafer fusion; wavelength multiplexers; Channel spacing; Directional couplers; Etching; Indium phosphide; Multiplexing; Optical interconnections; Optical waveguides; Photonic integrated circuits; Substrates; Wafer bonding;
Conference_Titel :
LEOS '99. IEEE Lasers and Electro-Optics Society 1999 12th Annual Meeting
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5634-9
DOI :
10.1109/LEOS.1999.811772
