• DocumentCode
    3404230
  • Title

    Dispersion properties of four and five coupled microstrip lines in suspended substrate structure using hybrid mode formulation

  • Author

    Awasthi, Seema ; Srivastava, Kumar Vaibhav ; Biswas, Animesh

  • Author_Institution
    Dept. of Electr. Eng., Indian Inst. of Technol., Kanpur, India
  • Volume
    2
  • fYear
    2005
  • fDate
    4-7 Dec. 2005
  • Abstract
    In this paper, a full wave modal analysis is performed on four symmetric and asymmetric parallel-coupled microstrip lines and symmetric five-coupled microstrip lines in suspended substrates structures. The numerical procedure based on the modal analysis, is formulated to compute all the frequency-dependent normal mode parameters of four coupled microstrip lines structures. These parameters include phase constant, modal impedances and the dielectric losses of the coupled four lines for all four propagating modes. In addition, attempts have also been made to compute the propagation constant of various propagating modes of five-coupled microstrip lines of equal width and spacing in microstrip lines structure as well as in suspended substrate structure.
  • Keywords
    dielectric losses; dispersion (wave); microstrip lines; modal analysis; waveguide theory; asymmetric parallel-coupled microstrip lines; dielectric losses; dispersion properties; four coupled microstrip lines; frequency-dependent normal mode parameters; full wave modal analysis; hybrid mode formulation; modal impedances; phase constant; propagation constant; propagation modes; suspended substrate structure; symmetric five-coupled microstrip lines; symmetric parallel-coupled microstrip lines; Coupling circuits; Dielectric losses; Dielectric substrates; Frequency; Microstrip; Microwave integrated circuits; Microwave propagation; Modal analysis; Propagation constant; Transmission line matrix methods;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings
  • Print_ISBN
    0-7803-9433-X
  • Type

    conf

  • DOI
    10.1109/APMC.2005.1606374
  • Filename
    1606374