Title :
Electrochemical deposition and superhydrophobic behavior of Cu(CH3(CH2)12COO)2 on stainless steel
Author :
Zhao, Zhengang ; Zhang, Haifeng ; Zhao, Min ; Chen, Weiping ; Liu, Xiaowei
Author_Institution :
Dept. of Microelectron., Harbin Inst. of Technol., Harbin, China
Abstract :
The electrochemical deposition of Cu(CH3(CH2)12COO)2 was presented to make the stainless steel surface superhydrophobic. The substrate was polished by abrasive paper firstly to make the micro-structures on the surface, then rough surface was covered with the Cu(CH3(CH2)12COO)2 by the method of electrochemical deposition. By our experiment, the deposition time affects the wettability of stainless steel surface distinctly. When the deposition time is 3 hours, the steel surface has the best hydrophobic property, and the value of contact angle of the steel plate surface is about 154.5°.
Keywords :
abrasion; contact angle; copper compounds; crystal microstructure; electrodeposition; organic compounds; stainless steel; surface roughness; wetting; Cu(CH3(CH2)12COO)2; abrasion; contact angle; electrochemical deposition; microstructures; stainless steel; superhydrophobic surface; surface roughness; wettability; Abrasives; Contacts; Rough surfaces; Steel; Substrates; Surface roughness; Surface treatment; Cu(CH3(CH2)12COO)2; Electrochemical deposition; Stainless steel; Superhydrophobic surface;
Conference_Titel :
Optoelectronics and Microelectronics Technology (AISOMT), 2011 Academic International Symposium on
Conference_Location :
Harbin
Print_ISBN :
978-1-4577-0794-0
DOI :
10.1109/AISMOT.2011.6159374
