Title :
Conjugate Numerical Investigation of a Miniature Flat Plate Evaporator of Capillary Pumped Loop
Author :
Wan, Z.M. ; Liu, W. ; Liu, Y.L. ; Nakayama, A.
Author_Institution :
Huazhong Univ. of Sci. & Technol., Wuhan
Abstract :
The capillary pumped loop (CPL) is a two-phase thermal control device, which has become more active and interesting in the domain of electronics cooling. A two-dimensional conjugate numerical model for the miniature flat plate capillary evaporator is presented to describe liquid and vapor flow, heat transfer and phase change in the porous wick structure, liquid flow and heat transfer in the compensation cavity and heat transfer in the vapor grooves and metallic wall. The entire evaporator is solved with SIMPLE algorithm as a conjugate problem. The shape and location of vapor-liquid interface inside the wick are calculated, and side wall effect heat transfer limit is introduced to estimate the heat transport capability of capillary evaporator. The influences of different wall materials on the performance of miniature flat plate evaporator are discussed in detail, and the results show that evaporator with combined wall is capable of dissipating high heat flux and stabilizes the electronics devices temperature at a moderate temperature level.
Keywords :
capillarity; cooling; evaporation; flow through porous media; phase change materials; temperature control; two-phase flow; SIMPLE algorithm; capillary pumped loop; compensation cavity; conjugate numerical investigation; electronics cooling; electronics device temperature stabilization; heat flux dissipation; heat transfer; heat transport; liquid flow; metallic wall; miniature flat plate evaporator; phase change; porous wick structure; two-phase thermal control device; vapor flow; vapor grooves; vapor-liquid interface; wall material; Electronics cooling; Fluid flow; Heat sinks; Heat transfer; Industrial electronics; Reservoirs; Space heating; Surface resistance; Temperature control; Thermal resistance; capillary pumped loop; electronics cooling; flat plate evaporator; side wall effect heat transfer limit;
Conference_Titel :
Mechatronics and Automation, 2007. ICMA 2007. International Conference on
Conference_Location :
Harbin
Print_ISBN :
978-1-4244-0828-3
Electronic_ISBN :
978-1-4244-0828-3
DOI :
10.1109/ICMA.2007.4303799