• DocumentCode
    3405808
  • Title

    The effect of the intrinsic impedances of logic families on the predicted radiated emissions from printed circuit boards

  • Author

    Slattery, K. ; Fuller, G.

  • Author_Institution
    CKC Lab. Inc., Mariposa, CA, USA
  • fYear
    1990
  • fDate
    21-23 Aug 1990
  • Firstpage
    280
  • Lastpage
    283
  • Abstract
    Analysis results on modeling the effect that source and load impedances have upon the predicted emissions from printed circuit boards are presented. It is shown that, while controlling circuit geometries is important, knowing what effect the impedances of the signal source and the load will have upon the radiated emissions and being able to control those effects are also important. It is demonstrated that these two factors can change the predicted emissions quite dramatically. In the case of short tracelengths, emissions can be controlled through circuit geometry quite acceptably, the distance to the ground plane being the circuit board geometric variable that gives the most control. Unfortunately, when the tracelengths approach a quarter wavelength of one of the higher harmonics of the fundamental frequency, circuit board geometry does not have as much of an effect. At longer tracelengths, one must consider controlling the source and load impedance in order to reduce unwanted emissions. In addition, when only real resistive loads and sources are considered, the emissions from the circuit may actually be 10-15 dB higher than was presumed
  • Keywords
    electric impedance; electromagnetic compatibility; logic design; printed circuit design; intrinsic impedances; load impedance; logic families; predicted radiated emissions; printed circuit boards; source impedance; Aerospace electronics; Equations; Frequency; Impedance; Logic circuits; Predictive models; Printed circuits; Resistors; Space vector pulse width modulation; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1990. Symposium Record., 1990 IEEE International Symposium on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-7264-6
  • Type

    conf

  • DOI
    10.1109/ISEMC.1990.252774
  • Filename
    252774