Simultaneous switching noise coupling through via transition for a CMOS negative feedback Operational Amplifier in System-in-Package

Author

Bumhee Bae ; Yujeong Shim ; Jonghyun Cho ; Joungho Kim

Author_Institution

Dept. of Electr. Eng., KAIST, Daejeon, South Korea

fYear

2011

fDate

7-10 Aug. 2011

Firstpage

1

Lastpage

4

Abstract

In this paper, a modeling method [1] is proposed to investigate the simultaneous switching noise coupling path and effects on the Operational Amplifier (Op-Amp). This method combines an analytical model and interconnection models for the chip-package co-modeling and co-analysis. CMOS Op-Amp is fabricated by TSMC 0.25um to validate the modeling method. It was successfully demonstrated by simulation and measurement with SSN noise, which has the frequency from 10MHz to 3GHz. It shows the necessity for the chip-package co-modeling and co-simulation of the System-In-Package (SIP).

Keywords

CMOS analogue integrated circuits; feedback amplifiers; integrated circuit interconnections; integrated circuit noise; microwave amplifiers; operational amplifiers; system-in-package; CMOS negative feedback; SSN noise; TSMC; chip-package; frequency 10 MHz to 3 GHz; interconnection models; operational amplifier; size 0.25 mum; switching noise coupling; system-in-package; through via transition; Analytical models; Noise measurement; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on

Conference_Location

Seoul

ISSN

1548-3746

Print_ISBN

978-1-61284-856-3

Electronic_ISBN

1548-3746

Type

conf

DOI

10.1109/MWSCAS.2011.6026494

Filename

6026494