DocumentCode
3406084
Title
SEFOP: A novel approach to data path module placement
Author
Cheng, C.-L.E. ; Ho, C.-Y.
Author_Institution
LSI Logic Corp., Milpitas, CA, USA
fYear
1993
fDate
7-11 Nov. 1993
Firstpage
178
Lastpage
181
Abstract
This paper is concerned with utilizing regularity information of data path modules in placement and shows outstanding results. Similarity Extraction is applied first on a data path module given a set of slice numbers, a column number, and IO pin ordering followed by a three-level Force-Oriented Placement for determining relative locations of cells in the form of a cell matrix. exact pin locations, cell flipping, and row/column spacing are then estimated based on the cell placement. Experiments on cell-based designs demonstrate its performance over various generate-purpose approaches at far less CPU time on data path module designs.
Keywords
circuit layout; IO pin ordering; SEFOP; Similarity Extraction; column number; data path module placement; exact pin locations; regularity information; row/column spacing; slice numbers; three-level Force-Oriented Placement; Algorithm design and analysis; Application specific integrated circuits; Data mining; Design automation; Iterative algorithms; Large scale integration; Logic; Partitioning algorithms; Pins; Simulated annealing;
fLanguage
English
Publisher
ieee
Conference_Titel
Computer-Aided Design, 1993. ICCAD-93. Digest of Technical Papers., 1993 IEEE/ACM International Conference on
Conference_Location
Santa Clara, CA, USA
Print_ISBN
0-8186-4490-7
Type
conf
DOI
10.1109/ICCAD.1993.580052
Filename
580052
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