Title :
Effect of joint strength of PbSn and AuSn solders on temperature cycling tests in laser packages
Author :
Chang, H.L. ; Wang, S.C. ; Wang, C. ; Wang, C.M. ; Shi, T.T. ; Sheen, M.T. ; Chien, C.P. ; Chen, J.C. ; Wang, G.L. ; Kuang, J.H. ; Hsieh, K.C. ; Cheng, W.H.
Author_Institution :
Chunghwa Telecom Labs., Taoyuan, Taiwan
Abstract :
The effect of joint strength of PbSn and AuSn solders on temperature cycling tests in laser packages has been studies experimentally and numerically. It was found that the joint strength increased as temperature cycle number increased and then decreased after 300 cycles. The break surface of PbSn and AuSn solders showed that there increased the brittle manner in the solder joints after 300 temperature cycles. This joint strength decreased may be due to the brittle fractures associated with crack initiation in solder joints. A finite-element method (FEM) simulation of joint strength was in good agreement with the experimental measurements
Keywords :
brittle fracture; finite element analysis; gold alloys; lead alloys; materials testing; packaging; semiconductor lasers; soldering; thermal stress cracking; tin alloys; 1.3 mum; AuSn solders; PbSn solders; break surface; brittle; brittle fractures; crack initiation; finite-element method; joint strength; joint strength increase; laser packages; solder joints; temperature cycle number; temperature cycling tests; Assembly; Diode lasers; Electronics packaging; Fiber lasers; Finite element methods; Lasers and electrooptics; Soldering; Temperature; Testing; Thickness measurement;
Conference_Titel :
LEOS '99. IEEE Lasers and Electro-Optics Society 1999 12th Annual Meeting
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5634-9
DOI :
10.1109/LEOS.1999.811976
