Modeling and simulation of the squeeze film effect on the MEMS structures

In micro-scale, squeeze film damping plays an important effect on the performances of the MEMS structures. In this paper, the effects of slip, squeeze and perforation on the squeeze film damping between the plates are analyzed in theories. The squeeze film damping model is presented using Reynolds equation for compressible gas film and the linearized solutions of the equation are introduced. Heat transfer analogy has been applied to calculate the effective damping and stiffness coefficient of the film and discuss the effects of slip and perforated holes on the squeezed film for some conditions. Simulation results are compared with the theories solutions referred to references. It is indicated that the slip effect affects the characteristics of squeezed film, and the squeezed film damping and stiffness coefficients decreases with the increase of the radius of the perforated holes.