• DocumentCode
    3407059
  • Title

    Transfer impedance testing of multi-conductor shielded connectors of arbitrary cross-section

  • Author

    Dunwoody, Steven ; Vanderheyden, Eric

  • Author_Institution
    AMP Inc., Harrisburg, PA, USA
  • fYear
    1990
  • fDate
    21-23 Aug 1990
  • Firstpage
    581
  • Lastpage
    585
  • Abstract
    A novel transfer impedance test for shielded connectors is explored and documented which can be used effectively on multiconductor connectors of arbitrary cross-section such as the `D´ subminiature line of connectors. For connectors of average size the results are believable from DC up to 500 MHz. Of critical importance in the performance of shielded connectors is the quality of the cable shield to connector back shell termination. This test and fixturing method is designed to include this termination and allows environmental exposure without disturbing the interface. Results are displayed in real time with a fast sweep speed which facilitates evaluation and observation of shield performance under dynamic conditions. A variety of instruments may be used, but a vector network analyzer is recommended. It is concluded that the proposed method has many of the virtues necessary for consideration as a standard industry test methodology for transfer impedance of shielded connectors
  • Keywords
    electric connectors; electric impedance measurement; magnetic shielding; 0 to 500 MHz; D subminiature connectors; DC; EMC; arbitrary cross-section; cable shield quality; connector back shell termination; dynamic conditions; environmental exposure; multiconductor shielded connectors; shield performance; standard industry test methodology; transfer impedance test; vector network analyzer; Cable shielding; Conductors; Connectors; Design methodology; Frequency measurement; Impedance measurement; Instruments; Surface impedance; Testing; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility, 1990. Symposium Record., 1990 IEEE International Symposium on
  • Conference_Location
    Washington, DC
  • Print_ISBN
    0-7803-7264-6
  • Type

    conf

  • DOI
    10.1109/ISEMC.1990.252836
  • Filename
    252836