DocumentCode :
3407194
Title :
Susceptibility analysis of complex systems
Author :
Canavero, Flavio ; Pignari, Sergio ; Daniele, Vito
Author_Institution :
Dipartimento di Elettronica, Politecnico, Turin, Italy
fYear :
1990
fDate :
21-23 Aug 1990
Firstpage :
618
Lastpage :
621
Abstract :
A study of electromagnetic coupling effects on systems containing distributed elements and lumped linear components is presented. The structure is decomposed into sections containing multiconductor transmission lines and interconnection blocks holding lumped elements. The external field is assumed to interfere with line sections, but mutual influences among different sections are neglected. Both the sections and the blocks are treated as multiport components and characterized by their scattering parameters. The analysis is based on a correspondence matrix that accounts for the topology of connections between sections and blocks. Closed-form solutions are derived in the Laplace domain, and the temporal evolution of voltages and currents at any of the system ports is obtained by a numerical inversion. This method makes it possible to predict the susceptibility of complex systems and to verify the intra-system compatibility (especially crosstalk). The relative influence of circuit components and of line layouts on the severity of interferences is evidenced by simulation results
Keywords :
electromagnetic compatibility; electromagnetic induction; electromagnetic interference; linear network analysis; lumped parameter networks; matrix algebra; EMC; Laplace domain; circuit components; closed form solutions; complex systems; correspondence matrix; crosstalk; currents; distributed elements; electromagnetic coupling effects; external field; interconnection blocks; interferences; line layouts; lumped elements; lumped linear components; multiconductor transmission lines; multiport components; numerical inversion; scattering parameters; simulation results; susceptibility analysis; system ports; temporal evolution; topology; voltages; Closed-form solution; Crosstalk; Electromagnetic coupling; Integrated circuit interconnections; Interference; Multiconductor transmission lines; Scattering parameters; Topology; Transmission line matrix methods; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 1990. Symposium Record., 1990 IEEE International Symposium on
Conference_Location :
Washington, DC
Print_ISBN :
0-7803-7264-6
Type :
conf
DOI :
10.1109/ISEMC.1990.252843
Filename :
252843
Link To Document :
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