Solder self-alignment for optical MEMS

Author

Harsh, Kevin F. ; Kladitis, Paul E. ; Michalicek, M. Adrian ; Zhang, Jianglong ; Zhang, Wenge ; Tuantranont, Adisorn ; Bright, Victor M. ; Lee, Y.C.

Author_Institution

Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA

Volume

2

fYear

1999

fDate

1999

Firstpage

860

Abstract

This paper discusses the use of solder self-alignment to assemble novel three-dimensional MEMS and package MEMS with other optical devices with precision alignment. Soldering is a predominant technology for electronics assembly, and is being developed for optoelectronic passive alignment. Using solder, hundreds or thousands of precision alignments can be accomplished with a single batch reflow process, and the cost/alignment can be reduced by orders of magnitude

Keywords

batch processing (industrial); micro-optics; microassembling; optical arrays; optical fabrication; reflow soldering; batch reflow process; micro-lens array; micro-mirror array; optical MEMS; optoelectronic passive alignment; package MEMS; precision alignment; solder self-alignment; three-dimensional MEMS; Assembly; Costs; Electronics packaging; High speed optical techniques; Lenses; Manufacturing; Micromechanical devices; Optical devices; Self-assembly; Surface tension;

fLanguage

English

Publisher

ieee

Conference_Titel

LEOS '99. IEEE Lasers and Electro-Optics Society 1999 12th Annual Meeting

Conference_Location

San Francisco, CA

ISSN

1092-8081

Print_ISBN

0-7803-5634-9

Type

conf

DOI

10.1109/LEOS.1999.812006

Filename

812006