Title :
Solder self-alignment for optical MEMS
Author :
Harsh, Kevin F. ; Kladitis, Paul E. ; Michalicek, M. Adrian ; Zhang, Jianglong ; Zhang, Wenge ; Tuantranont, Adisorn ; Bright, Victor M. ; Lee, Y.C.
Author_Institution :
Dept. of Mech. Eng., Colorado Univ., Boulder, CO, USA
Abstract :
This paper discusses the use of solder self-alignment to assemble novel three-dimensional MEMS and package MEMS with other optical devices with precision alignment. Soldering is a predominant technology for electronics assembly, and is being developed for optoelectronic passive alignment. Using solder, hundreds or thousands of precision alignments can be accomplished with a single batch reflow process, and the cost/alignment can be reduced by orders of magnitude
Keywords :
batch processing (industrial); micro-optics; microassembling; optical arrays; optical fabrication; reflow soldering; batch reflow process; micro-lens array; micro-mirror array; optical MEMS; optoelectronic passive alignment; package MEMS; precision alignment; solder self-alignment; three-dimensional MEMS; Assembly; Costs; Electronics packaging; High speed optical techniques; Lenses; Manufacturing; Micromechanical devices; Optical devices; Self-assembly; Surface tension;
Conference_Titel :
LEOS '99. IEEE Lasers and Electro-Optics Society 1999 12th Annual Meeting
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-5634-9
DOI :
10.1109/LEOS.1999.812006
