UWB chip antenna design using LTCC multilayer technology for mobile applications

Author

Wu, Chun-Yih ; Tang, Chia-Lun ; Chen, An-Chia

Author_Institution

Comput. & Commun. & Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan

Volume

3

fYear

2005

fDate

4-7 Dec. 2005

Abstract

A compact surface-mount ultra-wideband (UWB) chip antenna fabricated using multilayer low-temperature co-fired ceramic (LTCC) technology is presented. The antenna, suitable for mobile applications, is of a two layered metal-plate structure and occupies a compact size of 14 × 10 × 1.5 mm³ only. With a very wide operating bandwidth of about 4.98 GHz, the antenna can cover the lower band of DS-UWB (3.1-4.85 GHz). The antenna radiation patterns at 4.0 GHz and the antenna gain are also measured and discussed.

Keywords

antenna radiation patterns; ceramic packaging; microwave antennas; mobile antennas; surface mount technology; ultra wideband antennas; 3.1 to 4.85 GHz; DS-UWB; LTCC multilayer technology; UWB chip antenna design; antenna gain; antenna radiation patterns; low-temperature co-fired ceramic technology; metal-plate structure; mobile antenna; ultra-wideband chip antenna; Antenna measurements; Antenna radiation patterns; Bandwidth; Ceramics; Gain measurement; Mobile antennas; Nonhomogeneous media; Surface-mount technology; Ultra wideband antennas; Ultra wideband technology;

fLanguage

English

Publisher

ieee

Conference_Titel

Microwave Conference Proceedings, 2005. APMC 2005. Asia-Pacific Conference Proceedings

Print_ISBN

0-7803-9433-X

Type

conf

DOI

10.1109/APMC.2005.1606570

Filename

1606570