DocumentCode
3407783
Title
Millimeter-wave/terahertz circuits and transceivers for broadband wireless systems
Author
Kawashima, Mitsumasa ; Seki, Takaya ; Hirata, Akihiko ; Kosugi, Takashi
Author_Institution
NTT Network Innovation Labs., NTT Corp., Yokosuka, Japan
fYear
2011
fDate
7-10 Aug. 2011
Firstpage
1
Lastpage
4
Abstract
This paper reviews millimeter-wave and terahertz wireless technological developments in NTT Corporation. We show a 60-GHz band transceiver with low temperature co-fired ceramic-system-in-package modules and MMICs. We also show a 120-GHz band wireless link using InP HEMT MMICs for 120-GHz band, 10-Gb/s broadband wireless link systems.
Keywords
broadband networks; high electron mobility transistors; millimetre wave integrated circuits; radio transceivers; system-in-package; InP HEMT MMIC; NTT Corporation; bandwidth 120 GHz; bandwidth 60 GHz; broadband wireless link systems; broadband wireless systems; co-fired ceramic-system-in-package modules; millimeter-wave/terahertz circuits; transceivers; Antennas; Fires; Frequency modulation; Gain; MMICs; Photonics; Radio frequency; 120-GHz; 60-GHz; Broadband; LTCC; MMIC; Millimeter-Wave; SiP; Terahertz;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (MWSCAS), 2011 IEEE 54th International Midwest Symposium on
Conference_Location
Seoul
ISSN
1548-3746
Print_ISBN
978-1-61284-856-3
Electronic_ISBN
1548-3746
Type
conf
DOI
10.1109/MWSCAS.2011.6026594
Filename
6026594
Link To Document