Title :
Progress in device processing for advanced ULSI-impact on lithography
Author_Institution :
Central Res. Lab., Hitachi Ltd., Tokyo, Japan
Abstract :
The semiconductor industry is now facing a major crisis because optical lithography will be reaching its cost effective limits near 130-100 nm design rule around the year 2003. This paper discusses the limit of current optical lithography and the world wide trends in developing post-optical lithographic processes
Keywords :
ULSI; lithography; photolithography; semiconductor technology; advanced ULSI; cost effective limits; device processing; lithography; optical lithography; post-optical lithographic processes; semiconductor industry; Chemical technology; Costs; Dielectric materials; Electron optics; Etching; Ion beams; Lithography; Particle beam optics; Ultra large scale integration; Ultraviolet sources;
Conference_Titel :
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
0-7803-4538-X
DOI :
10.1109/IIT.1999.812039
