DocumentCode
3408231
Title
Dependence of the effective p+ buried layer implant dose for reducing junction leakage on well-to-buried layer spacing
Author
Oh, Jae-Geun ; Lee, Jung-Ho ; Lee, Kil-Ho ; Lee, Sahng-Kyoo
Author_Institution
Semicond. Res. Div., Hyundai Electron. Ind. Co. Ltd., Kyoungki-do, South Korea
Volume
1
fYear
1999
fDate
1999
Firstpage
75
Abstract
We investigated the dependence of the effective p+ buried layer implant dose for reducing junction leakage current on well-to-buried layer spacing. P+-n junction leakage current characteristics as function of the projected range difference between the p+ buried layer and well show that minimum well-to-buried layer spacing for suppressing leakage current should be wider than 2 μm. Moreover, it is found that a wider well-to-buried layer spacing gives a lower buried layer dose available for suppressing junction leakage current. The junction leakage current characteristics with various well-to-buried layer spacings in conjunction with implanted doses of buried layer are closely related to the density of threading dislocations and their spatial extents from the buried layer. Taking these results and throughput issues due to low beam current performance at high energy range into account, the well depth should be decreased within the limit of acceptable transistor characteristics
Keywords
ULSI; boron; buried layers; dislocation density; elemental semiconductors; integrated circuit technology; ion implantation; leakage currents; semiconductor doping; silicon; LOCOS; Si:B; ULSI; effective p+ buried layer implant dose; implanted dose; junction leakage; leakage current; threading dislocation density; transistor characteristics; well depth; well-buried layer spacing; Electronics industry; Fabrication; Implants; Ion implantation; Leakage current; Substrates; Temperature; Throughput; Ultra large scale integration; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location
Kyoto
Print_ISBN
0-7803-4538-X
Type
conf
DOI
10.1109/IIT.1999.812055
Filename
812055
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