DocumentCode
3408441
Title
Coupled 3D electromagnetic, structural, and thermal finite element analysis as integral components of electronic product design
Author
Brauer, John R. ; Wallen, Patrick
Author_Institution
Ansoft Corp., Milwaukee, WI, USA
fYear
1996
fDate
22-24 Oct 1996
Firstpage
358
Lastpage
364
Abstract
Electronic product design is aided by coupled electromagnetic, structural, and thermal finite element analysis. Coupled electromagnetic and structural finite elements can predict motion vs. time in relays and in microelectromechanical systems (MEMS). Coupled electromagnetic and thermal finite elements can predict the temperature distributions in electronic packages
Keywords
design engineering; finite element analysis; micromechanical devices; packaging; relays; thermal analysis; 3D finite element analysis; electromagnetic analysis; electronic package; electronic product design; microelectromechanical system; relay; structural analysis; temperature distribution; thermal analysis; Actuators; Electromagnetic analysis; Electromagnetic coupling; Electromagnetic fields; Electronic packaging thermal management; Finite element methods; Integral equations; Magnetic losses; Nonlinear equations; Product design;
fLanguage
English
Publisher
ieee
Conference_Titel
WESCON/96
Conference_Location
Anaheim, CA
ISSN
1095-791X
Print_ISBN
0-7803-3274-1
Type
conf
DOI
10.1109/WESCON.1996.554014
Filename
554014
Link To Document