• DocumentCode
    3408464
  • Title

    Evaluation of HSDPA (3.5G) mobile link quality

  • Author

    Sedoyeka, E. ; Hunaiti, Z. ; Almasri, S. ; Cirstea, M. ; Rahman, A.

  • Author_Institution
    Anglia Ruskin Univ., Cambridge
  • fYear
    2008
  • fDate
    June 30 2008-July 2 2008
  • Firstpage
    1446
  • Lastpage
    1451
  • Abstract
    The modern and dynamic world has imposed pressure on technologies to match the speed at which the world is moving. Responding to the challenge, third generation (3G) technologies have introduced a new era of mobility not only for cellular phones but also for broadband services. With the rise of high bandwidth demand applications, a number of challenges emerge. This paper presents results obtained while testing the performance of the 3.5 G wireless broadband in a number of scenarios to reflect the end userspsila experience. The test evaluates high speed downlink packet access (HSDPA), a 3.5 G mobile technology, testing its link characteristics in different scenarios. During the test, four major link characteristics: latency, throughput, link stability and packet loss were tested. These are the characteristics that cause direct effects to the quality of service (QoS). The mobility features were also tested. The result shows that number of users highly affects QoS. To perform the test, the T-mobile of-the-shelf public available WebdasianpsilaWalk data card was used.
  • Keywords
    3G mobile communication; broadband networks; cellular radio; performance evaluation; quality of service; radio links; 3.5G mobile technology; 3.5G wireless broadband; broadband service; cellular phone; high speed downlink packet access; link stability; mobile link quality; mobility features; packet loss; performance testing; quality of service; third generation technology; Bandwidth; Cellular phones; Delay; Downlink; Multiaccess communication; Performance evaluation; Quality of service; Stability; Testing; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 2008. ISIE 2008. IEEE International Symposium on
  • Conference_Location
    Cambridge
  • Print_ISBN
    978-1-4244-1665-3
  • Electronic_ISBN
    978-1-4244-1666-0
  • Type

    conf

  • DOI
    10.1109/ISIE.2008.4676926
  • Filename
    4676926