Title :
Application of SEMI S8-95 (ergonomics) for 200 mm and 300 mm Applied Materials ion implanters
Author :
Macklin, Ron ; Marin, Tony ; Taylor, Mark ; Lewman, Michael ; Vosper, Ian
Author_Institution :
Implant Div., Appl. Mater., Austin, TX, USA
Abstract :
As the move progresses toward more efficient use of floor space within the semiconductor fabrication plants, capital equipment layout will become denser in terms of component spacing, decreasing the room once available for maintenance activities. Along with this reduction in floor space the up-scaling of components due to wafer size and equipment will further impact the overall foot print of equipment. Furthermore, this trend will drive the reduction of personnel and equipment within the cleanrooms to a minimum. Given all these factors, ergonomic designs and controls are becoming more and more important to both the supplier and end users of high technology equipment. Applied Materials is actively working on many solutions, addressed within the SEMI S8-95 standard with an emphasis on the SESC guidelines. Applied Materials has reviewed the xRS series, including the new 300 mm implanters, reviewing areas such as (1) manual handling equipment for both 200 mm and 300 mm products; (2) in-situ handling and maintenance aids; (3) general human factor issues; (4) the design of cleanroom compatible tools to properly and safely perform the required maintenance functions within a 1 meter, service access between tools
Keywords :
ion implantation; semiconductor device manufacture; semiconductor doping; 200 mm; 300 mm; SEMI S8-95 standard; SESC guidelines; applied materials ion implanters; capital equipment layout; cleanroom compatible tools; cleanrooms; component spacing; human factor issues; in-situ handling; maintenance aids; maintenance functions; manual handling equipment; semiconductor fabrication plants; wafer size; xRS series; Ergonomics; Guidelines; Implants; Insulators; Materials handling; Product safety; Safety devices; Semiconductor materials; Valves; Wheels;
Conference_Titel :
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location :
Kyoto
Print_ISBN :
0-7803-4538-X
DOI :
10.1109/IIT.1999.812073