• DocumentCode
    3408624
  • Title

    Designing optimum heat sinks

  • Author

    Zuzmin, G.

  • Author_Institution
    Aavid Thermal Technol. Inc., USA
  • fYear
    1996
  • fDate
    22-24 Oct 1996
  • Firstpage
    365
  • Lastpage
    372
  • Abstract
    Increases in heat and heat concentration from microelectronics devices, combined with the reduction in overall form factors, make it essential to optimize heat sink designs with the least possible trade-offs in materials and manufacturing costs. In predicting the thermal performance of a heat sink, one of the unknown, hard-to-estimate parameters is the impact of actual conditions upon its theoretical performance. Of special interest is recognition of how the approach velocity of the incoming air, and the manner in which it presented, impacts the performance of the heat sink. This paper presents a orderly overview of the process for optimizing heat sinks including a discussion on the analytical simulation tools/techniques for predicting and optimizing the thermal performance of heat sinks
  • Keywords
    heat sinks; heat sink; microelectronics device; simulation; thermal design optimization; Cogeneration; Design engineering; Design optimization; Heat engines; Heat sinks; Manufacturing; Resistance heating; Thermal engineering; Thermal loading; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    WESCON/96
  • Conference_Location
    Anaheim, CA
  • ISSN
    1095-791X
  • Print_ISBN
    0-7803-3274-1
  • Type

    conf

  • DOI
    10.1109/WESCON.1996.554015
  • Filename
    554015