DocumentCode
3408624
Title
Designing optimum heat sinks
Author
Zuzmin, G.
Author_Institution
Aavid Thermal Technol. Inc., USA
fYear
1996
fDate
22-24 Oct 1996
Firstpage
365
Lastpage
372
Abstract
Increases in heat and heat concentration from microelectronics devices, combined with the reduction in overall form factors, make it essential to optimize heat sink designs with the least possible trade-offs in materials and manufacturing costs. In predicting the thermal performance of a heat sink, one of the unknown, hard-to-estimate parameters is the impact of actual conditions upon its theoretical performance. Of special interest is recognition of how the approach velocity of the incoming air, and the manner in which it presented, impacts the performance of the heat sink. This paper presents a orderly overview of the process for optimizing heat sinks including a discussion on the analytical simulation tools/techniques for predicting and optimizing the thermal performance of heat sinks
Keywords
heat sinks; heat sink; microelectronics device; simulation; thermal design optimization; Cogeneration; Design engineering; Design optimization; Heat engines; Heat sinks; Manufacturing; Resistance heating; Thermal engineering; Thermal loading; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
WESCON/96
Conference_Location
Anaheim, CA
ISSN
1095-791X
Print_ISBN
0-7803-3274-1
Type
conf
DOI
10.1109/WESCON.1996.554015
Filename
554015
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