Cost of ownership methodology for 300 mm ion implantation processes

IC manufacturers have stated that the price of 300 mm process equipment should be no more than 1.3 times the 200 mm equivalent equipment. Further, simultaneous technology advances are required for sub 0.25 μm processing, creating challenges for the equipment industry. Economic and technical issues differ among process equipment and must be addressed within the context of the process. This paper discusses the aspects of a cost of ownership methodology for wafer size increase and applies the method to high energy ion implantation processes. Depending on the productivity factors related to the number of chips per wafer, significant die cost reductions are available to IC manufacturers over a wide range of 300 mm equipment prices