DocumentCode :
3408833
Title :
The trend toward Pd/Ni contacts in high density interconnects
Author :
Williams, Lawson
Author_Institution :
Ranoda Electron. Inc., Miami, FL, USA
fYear :
1996
fDate :
22-24 Oct 1996
Firstpage :
374
Lastpage :
376
Abstract :
Having experienced the benefits of Palladium Nickel use for connector contacts, introduction of this cost saving opportunity to Ranoda´s connector users was a top priority. Ranoda was able to demonstrate the true value of this contact finishing plating and have it specified for use quickly. This accomplished by true concurrent engineering with the customers process and component engineering design engineering centers, the metal finishers chemical engineers and the Ranoda engineering center. This concurrent engineering effort has shown positive results with a very large and influential group of high technology systems manufacturers domestically and internationally
Keywords :
concurrent engineering; electric connectors; electrical contacts; electroplated coatings; nickel; palladium; Pd-Ni; chemical plating; concurrent engineering; connector contact; high density interconnect; palladium nickel; Chemical engineering; Chemical processes; Concurrent engineering; Connectors; Contacts; Costs; Design engineering; Finishing; Nickel; Palladium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
WESCON/96
Conference_Location :
Anaheim, CA
ISSN :
1095-791X
Print_ISBN :
0-7803-3274-1
Type :
conf
DOI :
10.1109/WESCON.1996.554016
Filename :
554016
Link To Document :
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