DocumentCode :
3409003
Title :
A full-swing bootstrapped BiCMOS buffer
Author :
Brauer, Elizabeth J. ; Elamanchili, Pradeep
Author_Institution :
Dept. of Electr. Eng., Kentucky Univ., Lexington, KY, USA
fYear :
1997
fDate :
13-15 Mar 1997
Firstpage :
8
Lastpage :
13
Abstract :
Bipolar circuits have high drive capability with low delay sensitivity to load while CMOS circuits have low power dissipation and high packing density. Combining both bipolar and MOS transistors on one monolithic substrate, Bipolar-CMOS (BiCMOS) circuits have high drive capability and low power dissipation at the expense of increased fabrication complexity. A major problem with conventional BiCMOS circuits is the reduced output swing due to the bipolar output transistors. This paper presents a novel BiCMOS circuit which uses bootstrapping to attain a full logic swing at the output. We present a design equation to estimate the size of the bootstrap capacitance as a function of power supply voltage. Simulations were performed using parameters from a 2.0 μm CMOS process with NPN option at supply voltages of 3.3 and 5 V. The circuit is a practical design which improves on the delay and power performance of previous bootstrapped BiCMOS inverters
Keywords :
BiCMOS digital integrated circuits; BiCMOS logic circuits; bootstrap circuits; buffer circuits; circuit analysis computing; delays; integrated circuit design; logic design; logic gates; transient analysis; 2 mum; 2.0 μm CMOS process; 3.3 V; 5 V; bootstrap capacitance; bootstrapped BiCMOS inverters; delay performance; design equation; full logic swing; full-swing bootstrapped BiCMOS buffer; high drive capability; low power dissipation; power performance; power supply voltage dependence; propagation delay; simulations; transient analysis; BiCMOS integrated circuits; Bipolar transistor circuits; CMOS logic circuits; Delay; Drives; Fabrication; Logic circuits; MOSFETs; Power dissipation; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI, 1997. Proceedings. Seventh Great Lakes Symposium on
Conference_Location :
Urbana-Champaign, IL
ISSN :
1066-1395
Print_ISBN :
0-8186-7904-2
Type :
conf
DOI :
10.1109/GLSV.1997.580403
Filename :
580403
Link To Document :
بازگشت