• DocumentCode
    3409057
  • Title

    The electrodeposition and material properties of palladium nickel alloys

  • Author

    Abys, J.A. ; Kudrak, E.J. ; Maisano, J.J. ; Blair, A.

  • Author_Institution
    Lucent Technol., AT&T Bell Labs., Murray Hill, NJ, USA
  • fYear
    1996
  • fDate
    22-24 Oct 1996
  • Firstpage
    377
  • Lastpage
    386
  • Abstract
    The deregulation of gold in the early 1970s coupled with political and economic events of that era brought about an astronomical increase in its price in the late 1970´s and early 1980s. Since then gold has traded in the range of $320 to $440 per troy ounce, approximately ten times is price prior to deregulation. Thus, the major impetus for replacing gold as a contact material for electronic applications has been economic. Substituting palladium and palladium-nickel alloys for gold has proved to be highly rewarding. Not only is a significant cost reduction realized, but the technological advantages of this substitution are generally recognized today. This paper reports the development of a process for electroplating palladium-nickel films of compositions from 10 to 30 weight percent nickel. The material properties and contact reliability of the deposited films will also be presented
  • Keywords
    electrical contacts; electrochemistry; electroplating; metallic thin films; nickel alloys; palladium alloys; Pd-Ni; electrodeposition; electronic contact reliability; electroplating; material properties; palladium nickel alloy film; Conductivity; Costs; Current density; Gold alloys; Material properties; Materials reliability; Nickel alloys; Palladium; Space technology; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    WESCON/96
  • Conference_Location
    Anaheim, CA
  • ISSN
    1095-791X
  • Print_ISBN
    0-7803-3274-1
  • Type

    conf

  • DOI
    10.1109/WESCON.1996.554017
  • Filename
    554017