DocumentCode
3409652
Title
Pressure based mass flow control for ion implant SDS applications
Author
Brown, Robert L. ; Schwartz, James M.
Author_Institution
Novasource Div., ATMI Inc., Danbury, CT, USA
Volume
1
fYear
1999
fDate
1999
Firstpage
369
Abstract
Thermal mass flow control (MFC) has been used to control the flow of gas in semiconductor process systems for many years. With the introduction of SDS gas sources for ion implantation, improvements in mass flow control technology were required to maximize cylinder yield and effect a corresponding reduction in operating cost. Pressure-based MFC (PMFC) is an alternative to thermal flow control technology. Discussed are the design and operating principles of PMFC´s utilizing the principal of “choked” (sonic) flow for applications with inlet pressures to below 10 torr. A comparison is made between the PMFC and thermal MFC techniques. A significant increase in throughput per bottle is presented for a device with 6 torr inlet pressure capability
Keywords
flow control; ion implantation; semiconductor doping; semiconductor technology; SDS gas sources; cylinder yield; design; inlet pressures; ion implant SDS applications; ion implantation; operating cost; operating principles; pressure based mass flow control; semiconductor process systems; thermal mass flow control; Atmosphere; Control systems; Fluid flow measurement; Gases; Implants; Pressure control; Pressure measurement; Proportional control; Valves; Weight control;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location
Kyoto
Print_ISBN
0-7803-4538-X
Type
conf
DOI
10.1109/IIT.1999.812130
Filename
812130
Link To Document