Title :
Cooling and power considerations for semiconductors into the next century
Author :
Belady, Christian
Author_Institution :
Hewlett-Packard Co., Richardson, TX, USA
Abstract :
With semiconductor power increasing rapidly, there is no doubt that package level cooling and infrastructure level power and cooling issues are important engineering problems to solve. Some of the relevant issues are discussed in this paper
Keywords :
cooling; semiconductor device packaging; technological forecasting; thermal management (packaging); infrastructure-level cooling; infrastructure-level power delivery; package-level cooling; semiconductor chip; CMOS technology; Companies; Computer aided manufacturing; Electronic packaging thermal management; Electronics cooling; Permission; Power engineering and energy; Power engineering computing; Telecommunication computing; Thermal engineering;
Conference_Titel :
Low Power Electronics and Design, International Symposium on, 2001.
Conference_Location :
Huntington Beach, CA
Print_ISBN :
1-58113-371-5
DOI :
10.1109/LPE.2001.945383
