• DocumentCode
    3410052
  • Title

    SIMS modular approach to ultra-low energy implants for accurate TCAD process simulation modeling

  • Author

    Chia, Victor K.F. ; Edgell, Michael J. ; Biswas, Sukanta

  • Author_Institution
    C. Evans & Assoc., Redwood City, CA, USA
  • Volume
    1
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    461
  • Abstract
    The use of technology computer-aided design (TCAD) for IC design, technology development and semiconductor fabrication has grown. The motivation of new users of TCAD is to solve technology problems in the shortest time possible and at the lowest cost. TCAD programs allow process flows, as well as device and circuit performance to be simulated using a combination of simulation tools. TCAD modeling of MOS (metal oxide semiconductor) and bipolar technologies requires selective SIMS (secondary ion mass spectrometry) measurements for calibration. In this paper we present the SIMS Modular Approach to ultra-low energy (ULE) implants for accurate TCAD process simulation modeling. We will illustrate the principle of the SIMS Modular Approach with examples of ULE implants of boron, arsenic, and phosphorus that were unannealed (i.e., as implanted) and annealed. Our study showed that for a given ULE implant, several combinations of SIMS instruments and analytical conditions are needed to extract different information relating to the implant
  • Keywords
    MOS integrated circuits; calibration; ion implantation; secondary ion mass spectra; secondary ion mass spectroscopy; semiconductor process modelling; technology CAD (electronics); IC design; MOS technology; SIMS modular approach; bipolar technology; calibration; semiconductor fabrication; simulation modeling; technology computer-aided design; ultra-low energy implants; Boron; Calibration; Circuit optimization; Circuit simulation; Computational modeling; Costs; Design automation; Fabrication; Implants; Mass spectroscopy;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ion Implantation Technology Proceedings, 1998 International Conference on
  • Conference_Location
    Kyoto
  • Print_ISBN
    0-7803-4538-X
  • Type

    conf

  • DOI
    10.1109/IIT.1999.812152
  • Filename
    812152