DocumentCode
3410052
Title
SIMS modular approach to ultra-low energy implants for accurate TCAD process simulation modeling
Author
Chia, Victor K.F. ; Edgell, Michael J. ; Biswas, Sukanta
Author_Institution
C. Evans & Assoc., Redwood City, CA, USA
Volume
1
fYear
1999
fDate
1999
Firstpage
461
Abstract
The use of technology computer-aided design (TCAD) for IC design, technology development and semiconductor fabrication has grown. The motivation of new users of TCAD is to solve technology problems in the shortest time possible and at the lowest cost. TCAD programs allow process flows, as well as device and circuit performance to be simulated using a combination of simulation tools. TCAD modeling of MOS (metal oxide semiconductor) and bipolar technologies requires selective SIMS (secondary ion mass spectrometry) measurements for calibration. In this paper we present the SIMS Modular Approach to ultra-low energy (ULE) implants for accurate TCAD process simulation modeling. We will illustrate the principle of the SIMS Modular Approach with examples of ULE implants of boron, arsenic, and phosphorus that were unannealed (i.e., as implanted) and annealed. Our study showed that for a given ULE implant, several combinations of SIMS instruments and analytical conditions are needed to extract different information relating to the implant
Keywords
MOS integrated circuits; calibration; ion implantation; secondary ion mass spectra; secondary ion mass spectroscopy; semiconductor process modelling; technology CAD (electronics); IC design; MOS technology; SIMS modular approach; bipolar technology; calibration; semiconductor fabrication; simulation modeling; technology computer-aided design; ultra-low energy implants; Boron; Calibration; Circuit optimization; Circuit simulation; Computational modeling; Costs; Design automation; Fabrication; Implants; Mass spectroscopy;
fLanguage
English
Publisher
ieee
Conference_Titel
Ion Implantation Technology Proceedings, 1998 International Conference on
Conference_Location
Kyoto
Print_ISBN
0-7803-4538-X
Type
conf
DOI
10.1109/IIT.1999.812152
Filename
812152
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