• DocumentCode
    3411525
  • Title

    Physics-of-failure: an approach to reliable product development

  • Author

    Pecht, Michael ; Dasgupta, Abhijit

  • Author_Institution
    CALCE Center for Electron. Packaging Res., Maryland Univ., College Park, MD, USA
  • fYear
    1995
  • fDate
    22-25 Oct. 1995
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Reliability assessments based on physics-of-failure methods incorporate reliability into the design process to prevent parts from failing in service. An understanding of the physics-of-failure is necessary in applications which afford little opportunity for testing, or for reliability growth. This paper presents an overview of physics-of-failure and a case study of the application of physics-of-failure to a specific failure mechanism called conductive filament formation.
  • Keywords
    design for manufacture; electronics industry; failure analysis; product development; reliability; conductive filament formation; design process; failure mechanism; physics-of-failure methods; reliability assessment; reliable product development; Aerospace materials; Costs; Electronics packaging; Failure analysis; Mathematical model; Process design; Product design; Product development; Thermal stresses; Virtual manufacturing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop, 1995. Final Report., International
  • Conference_Location
    Lake Tahoe, CA, USA
  • Print_ISBN
    0-7803-2705-5
  • Type

    conf

  • DOI
    10.1109/IRWS.1995.493566
  • Filename
    493566