DocumentCode
3411699
Title
Fast detection of mobile ions for WLR monitoring
Author
Xia, Wei ; Scarpulla, John ; Young, Michael ; Sabin, Edwin ; Anderson, Larry
Author_Institution
Silicon Syst. Inc., Tustin, CA, USA
fYear
1995
fDate
22-25 Oct. 1995
Firstpage
61
Lastpage
65
Abstract
A new fast electrical technique for the detection of mobile ions in silicon processes using a simple field oxide test structure is presented. The method is ideal for WLR monitoring of mobile ions since its throughput is much higher than conventional slower methods such as the BTS (bias temperature sweep) method. The technique is based upon biasing a field oxide FET in a configuration resembling a source-follower, and observing the time varying output voltage. A simple model based upon ideal MOSFET characteristics is used to interpret the voltage waveforms produced by the new fast method. Data from about 30 wafer lots is presented, and a comparison made between the new method and a HTBS (high temperature bias sweep) measurement-a modified version of the BTS method. The correlation was found to be greatly improved by introducing a short bake to diffuse the mobile ions (suspected to be Na) into the region of the field oxide near the channel.
Keywords
integrated circuit manufacture; integrated circuit measurement; integrated circuit reliability; integrated circuit testing; monitoring; Si; Sil processes; WLR monitoring; biasing; fast electrical technique; field oxide FET; field oxide test structure; ideal MOSFET characteristics; mobile ions detection; model; time varying output voltage; voltage waveforms; wafer level reliability; FETs; MOSFETs; Monitoring; Resists; Semiconductor device modeling; Silicon; System testing; Temperature measurement; Throughput; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop, 1995. Final Report., International
Conference_Location
Lake Tahoe, CA, USA
Print_ISBN
0-7803-2705-5
Type
conf
DOI
10.1109/IRWS.1995.493577
Filename
493577
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