• DocumentCode
    3411722
  • Title

    A new physics-based model for time-dependent-dielectric-breakdown

  • Author

    Schlund, Barry ; Messick, Cleston ; Suehle, John ; Chaparala, Prasad

  • Author_Institution
    Motorola Inc., Scottsdale, AZ, USA
  • fYear
    1995
  • fDate
    22-25 Oct. 1995
  • Firstpage
    72
  • Lastpage
    80
  • Abstract
    A new, physics based model for time dependent dielectric breakdown has been developed, and is presented along with test data obtained by NIST on oxides provided by National Semiconductor. Testing included fields from 5.6 MV/cm to 12.7 MV/cm, and temperatures ranging from 60/spl deg/C to 400/spl deg/C. The physics, mathematical model and test data, all confirm a linear, rather than an inverse field dependence. The primary influence on oxide breakdown was determined to be due to the dipole interaction energy of the field with the orientation of the molecular dipoles in the dielectric. The resultant failure mechanism is shown to be the formation and coalescence of vacancy defects, similar to that proposed by Dumin et al.
  • Keywords
    MIS devices; electric breakdown; failure analysis; semiconductor device models; semiconductor device reliability; vacancies (crystal); 60 to 400 degC; MOS devices; NIST; dipole interaction energy; failure mechanism; linear field dependence; mathematical model; molecular dipole orientation; oxide breakdown; physics-based model; time-dependent-dielectric-breakdown; vacancy defects; Capacitive sensors; Compressive stress; Dielectric breakdown; Impact ionization; NIST; Physics; Semiconductor device testing; Temperature dependence; Thermal stresses; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Integrated Reliability Workshop, 1995. Final Report., International
  • Conference_Location
    Lake Tahoe, CA, USA
  • Print_ISBN
    0-7803-2705-5
  • Type

    conf

  • DOI
    10.1109/IRWS.1995.493579
  • Filename
    493579