DocumentCode
3411722
Title
A new physics-based model for time-dependent-dielectric-breakdown
Author
Schlund, Barry ; Messick, Cleston ; Suehle, John ; Chaparala, Prasad
Author_Institution
Motorola Inc., Scottsdale, AZ, USA
fYear
1995
fDate
22-25 Oct. 1995
Firstpage
72
Lastpage
80
Abstract
A new, physics based model for time dependent dielectric breakdown has been developed, and is presented along with test data obtained by NIST on oxides provided by National Semiconductor. Testing included fields from 5.6 MV/cm to 12.7 MV/cm, and temperatures ranging from 60/spl deg/C to 400/spl deg/C. The physics, mathematical model and test data, all confirm a linear, rather than an inverse field dependence. The primary influence on oxide breakdown was determined to be due to the dipole interaction energy of the field with the orientation of the molecular dipoles in the dielectric. The resultant failure mechanism is shown to be the formation and coalescence of vacancy defects, similar to that proposed by Dumin et al.
Keywords
MIS devices; electric breakdown; failure analysis; semiconductor device models; semiconductor device reliability; vacancies (crystal); 60 to 400 degC; MOS devices; NIST; dipole interaction energy; failure mechanism; linear field dependence; mathematical model; molecular dipole orientation; oxide breakdown; physics-based model; time-dependent-dielectric-breakdown; vacancy defects; Capacitive sensors; Compressive stress; Dielectric breakdown; Impact ionization; NIST; Physics; Semiconductor device testing; Temperature dependence; Thermal stresses; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
Integrated Reliability Workshop, 1995. Final Report., International
Conference_Location
Lake Tahoe, CA, USA
Print_ISBN
0-7803-2705-5
Type
conf
DOI
10.1109/IRWS.1995.493579
Filename
493579
Link To Document