DocumentCode :
3413139
Title :
Low voltage operation of sub-quarter micron W-polycide dual gate CMOS with non-uniformly doped channel
Author :
Sayama, H. ; Kuroi, T. ; Shimizu, S. ; Shirahata, M. ; Okumura, Y. ; Inuishi, M. ; Miyoshi, H.
Author_Institution :
ULSI Lab., Mitsubishi Electr. Corp., Itami, Japan
fYear :
1996
fDate :
8-11 Dec. 1996
Firstpage :
583
Lastpage :
586
Abstract :
A 0.25 /spl mu/m W-polycide dual gate CMOS has been newly developed for a logic in DRAM under low voltage operation. A novel gate electrode can eliminate inter-diffusion and the gate depletion using a barrier oxide film against dopant diffusion, so that a dual gate CMOS can be fabricated with sufficient thermal budget. Moreover, low threshold voltage and high current drivability can be obtained by a non-uniformly doped channel structure formed by the oblique rotational ion implantation utilizing W-polycide gate as a mask. As a result, a high performance has been achieved.
Keywords :
CMOS digital integrated circuits; diffusion barriers; doping profiles; integrated circuit metallisation; ion implantation; 0.25 micron; LV operation; LV voltage; W-polycide dual gate CMOS; WSi/sub 2/-Si; barrier oxide film; dopant diffusion prevention; gate depletion; gate electrode; high current drivability; inter-diffusion elimination; logic in DRAM; low voltage operation; nonuniformly doped channel; oblique rotational ion implantation; sub-quarter micron CMOS; Boron; CMOS logic circuits; Conductive films; Electrodes; Ion implantation; Logic devices; Low voltage; Random access memory; Silicides; Threshold voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting, 1996. IEDM '96., International
Conference_Location :
San Francisco, CA, USA
ISSN :
0163-1918
Print_ISBN :
0-7803-3393-4
Type :
conf
DOI :
10.1109/IEDM.1996.554051
Filename :
554051
Link To Document :
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