Title :
Information technology product recycling. An OEM/recycler collaboration
Author :
Denis, Renee St ; Skurnac, Steve
Author_Institution :
Hewlett-Packard Co., Riseville, CA, USA
Abstract :
Hewlett-Packard´s hardware recycling operation has gone through significant changes in the past several years in response to changes in recycling markets and recycling technology, As recently as three years ago, most electronic scrap could be recycled or be sold into secondary markets and generate positive returns for OEMs and equipment brokers. Even two gears ago, integrated circuit values from old hardware generated enough revenue to offset total recycling costs. Lower values for resale components, coupled with lower precious metal value, the lack of recycling options for mixed plastic streams which do not have inherent long term liabilities associated with them and the cost of disposing of mixed material streams have combined to increase net recycling costs for electronic hardware. Today HP, like most OEMs, struggles to reduce the costs associated with hardware recycling activities while maintaining environmental compliance. One of the ways Hewlett-Packard Company has met the need to assure environmental compliance while controlling the cost of disposing of low value scrap is to create a strategic alliance with Noranda Metallurgy. The HP-Noranda alliance brings together the unique strengths and perspectives of two key players in the IT recycling value chain in order to maximize efficiencies and environmental assurance while reducing short-term cost and long-term financial exposure
Keywords :
DP industry; recycling; Hewlett-Packard; IT hardware; Noranda Metallurgy; OEM; electronic scrap; environmental compliance; information technology; integrated circuit; mixed plastic stream; precious metal; product recycling; recycler; Consumer electronics; Costs; Coupling circuits; Gears; Hardware; Information technology; Inorganic materials; Integrated circuit technology; Plastics; Recycling;
Conference_Titel :
Electronics and the Environment, 1998. ISEE-1998. Proceedings of the 1998 IEEE International Symposium on
Conference_Location :
Oak Brook, IL
Print_ISBN :
0-7803-4295-X
DOI :
10.1109/ISEE.1998.675047