• DocumentCode
    3414527
  • Title

    Design of a Generic Network on Chip Frame Work Using Wormhole Routing for 2D Mesh

  • Author

    Sanju, V. ; Chiplunkar, Niranjan N. ; Uma, R.

  • Author_Institution
    Nitte Meenakshi Inst. Of Technol., Bangalore, India
  • fYear
    2009
  • fDate
    18-20 Dec. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The requirements of high performance mega functional solutions are becoming important day by day. With the advancement in semiconductor devices and fabrication technology, it is possible to pack more logic in smaller area of silicon. But the implementation of these mega functional modules using common bus architecture, parallel bus architecture, pipelining are becoming ineffective and posing a bottleneck in terms of performance and throughput in this billion transistor era. To overcome these performance issues, a new paradigm in interconnect technology was proposed. The proposal is to implant the concept of data transfer in data communication networks providing advantages of low power scalable high performance architecture. This can be achieved with a small increase in silicon area, for routing resources. This paper discusses the design of a generic frame work for wormhole routing strategy for 2D mesh topology. It also discusses the data transfer operation and other aspects of this frame work.
  • Keywords
    elemental semiconductors; low-power electronics; multiprocessor interconnection networks; network routing; network topology; network-on-chip; silicon; 2D mesh topology; Si; data communication network; data transfer; interconnect technology; low power scalable high performance architecture; network-on-chip; silicon; wormhole routing; Fabrication; Implants; Logic devices; Network-on-a-chip; Pipeline processing; Proposals; Routing; Semiconductor devices; Silicon; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    India Conference (INDICON), 2009 Annual IEEE
  • Conference_Location
    Gujarat
  • Print_ISBN
    978-1-4244-4858-6
  • Electronic_ISBN
    978-1-4244-4859-3
  • Type

    conf

  • DOI
    10.1109/INDCON.2009.5409407
  • Filename
    5409407