• DocumentCode
    3415021
  • Title

    Investigation about the electro-thermal behavior of high power/high frequency planar transformers

  • Author

    Buccella, Concettina ; Cecati, Carlo ; De Monte, Filippo

  • Author_Institution
    Dept. of Electr. & Inf. Eng., Univ. of L´´Aquila & DigiPower s.r.l., L´´Aquila
  • fYear
    2008
  • fDate
    June 30 2008-July 2 2008
  • Firstpage
    374
  • Lastpage
    379
  • Abstract
    Planar transformers are a good choice when designing high frequency switching mode power supply (SMPS). Since these devices have some advantages over wound transformers that improve the SMPS performances, their use is growing in the last years. One of them is that, due to the planar geometry and proximity of the windings, parasitic effects at high frequency can be reduced. This paper presents a study of two different winding arrangements to compute the electromagnetic loss and the temperature distribution inside the planar transformer. The study is carried out using the finite element analysis and taking into account the frequency effects for the electromagnetic model. A finite element algorithm is also applied to solve the thermal model for the computation of the temperature distribution. An experimental prototype is built and measurements are performed validating the numerical results.
  • Keywords
    electromagnetic devices; finite element analysis; power transformers; switched mode power supplies; transformer windings; electromagnetic loss; electromagnetic model; electrothermal behavior; finite element analysis; high power-high frequency planar transformers; parasitic effects; switching mode power supply; temperature distribution; wound transformers; Distributed computing; Electromagnetic analysis; Finite element methods; Frequency; Geometry; Magnetic losses; Switched-mode power supply; Temperature distribution; Transformers; Wounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Industrial Electronics, 2008. ISIE 2008. IEEE International Symposium on
  • Conference_Location
    Cambridge
  • Print_ISBN
    978-1-4244-1665-3
  • Electronic_ISBN
    978-1-4244-1666-0
  • Type

    conf

  • DOI
    10.1109/ISIE.2008.4677298
  • Filename
    4677298