DocumentCode :
3415368
Title :
Noise Suppression in High Speed Digital Circuits by Means of a Novel EBG Structure with Triangle Patches and Hexagonal Arrays
Author :
Scogna, A. Ciccomancini
Author_Institution :
CST of America Inc, Laurel
fYear :
2007
fDate :
9-13 July 2007
Firstpage :
1
Lastpage :
6
Abstract :
Aim of this paper is to describe the simultaneous switching noise (SSN) mitigation by means of a novel electromagnetic band gap (EBG) structure with triangle patches and hexagonal array. The proposed EBG structure allows achieving -40 dB stop band within the frequency range 6.5-9 GHz. Parametric analysis including the radius effect of the metal plated vias, the via length and the distance between the patches is performed by means of full wave simulations, based on the Finite Integration Technique. The impact of the proposed design on the signal integrity is also investigated both in time domain (eye-diagrams and TDR) and frequency domain (S-parameters). Finally dispersion diagrams of the singular unit EBG cell are analyzed by means of eigenmode solver and periodic boundary conditions.
Keywords :
circuit noise; digital circuits; eigenvalues and eigenfunctions; electromagnetic interference; frequency-domain analysis; interference suppression; microwave circuits; photonic band gap; printed circuits; time-domain analysis; EBG structure; PCB; S-parameters; TDR; dispersion diagrams; eigenmode solver; electromagnetic band gap; eye-diagrams; finite integration technique; frequency 6.5 GHz to 9 GHz; frequency domain analysis; hexagonal arrays; high-speed digital circuits; noise suppression; parametric analysis; periodic boundary condition; simultaneous switching noise mitigation; time domain analysis; triangle patches; Analytical models; Circuit noise; Digital circuits; Electromagnetic interference; Frequency domain analysis; Metamaterials; Performance analysis; Periodic structures; Scattering parameters; Signal design;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electromagnetic Compatibility, 2007. EMC 2007. IEEE International Symposium on
Conference_Location :
Honolulu, HI
Print_ISBN :
1-4244-1349-4
Electronic_ISBN :
1-4244-1350-8
Type :
conf
DOI :
10.1109/ISEMC.2007.16
Filename :
4305596
Link To Document :
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