Title :
SoC integration challenges for a power management/analog baseband IC for 3G wireless chipsets
Author :
Evans, David ; McConnell, Mike ; Kawamura, Patrick ; Krug, Lany
Author_Institution :
Wireless Analog Technol. Center, Texas Instrum. Inc., Dallas, TX, USA
Abstract :
An integrated power management/analog baseband integrated circuit has been developed in 0.35 μm CMOS technology. The IC features multiple low-dropout (LDO) linear voltage regulators, power switches, DC/DC switching converters, a voice band CODEC, and WCDMA and GSM baseband converters all sharing the same substrate. This paper examines the design challenges associated with power management and analog baseband system on a chip (SoC) integration. Optimal floorplanning, power device isolation, shielding, power distribution, reference generation, and noise reduction strategies and techniques are discussed.
Keywords :
3G mobile communication; CMOS integrated circuits; DC-DC power convertors; cellular radio; code division multiple access; electromagnetic shielding; integrated circuit layout; integrated circuit noise; speech codecs; switching convertors; system-on-chip; voltage regulators; 0.35 micron; 3G wireless chipsets; CMOS; DC/DC switching converters; GSM baseband converters; LDO regulators; SoC integration; UMTS; WCDMA baseband converters; analog baseband IC; audio/voice CODEC; floorplanning; low-dropout linear voltage regulators; noise reduction strategies; power device isolation; power distribution; power management IC; power switches; reference generation; shielding; system on a chip; voice band CODEC; CMOS integrated circuits; Code division multiaccess; DC-DC power conversion; Electromagnetic shielding; Integrated circuit layout; Integrated circuit noise; Land mobile radio cellular systems; Speech codecs;
Conference_Titel :
Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on
Print_ISBN :
4-88686-060-5
DOI :
10.1109/ISPSD.2004.1332863
