Title :
Class D digital power amp (PurePath Digital™) high Q musical content
Author :
Neesgaard, C. ; Antley, R. ; Efland, T. ; Kaya, C. ; Mochizuki, K. ; Nyboe, F. ; Risbo, L. ; Skelton, D. ; Unnikirishnan ; Zhao, A.
Author_Institution :
High Performance Analog, Digital Audio Products, Texas Instrum. Inc., Dallas, TX, USA
Abstract :
The complex aspects of digital class D audio amplification and related technology issues are discussed. The focus is on a 100 W into 4 Ω bridge-tied-load (BTL) power stage PIC. A 0.35 μm BCD technology (LBC5) having 50 V LDMOS, and 10 μm plated CuNiPd power metal, with bonding capability, was used to fabricate the chip.
Keywords :
BiCMOS integrated circuits; audio-frequency amplifiers; copper alloys; integrated circuit metallisation; nickel alloys; palladium alloys; power MOSFET; power amplifiers; power integrated circuits; 0.35 micron; 10 micron; 100 W; 4 ohm; 50 V; BCD technology; CuNiPd; LDMOS; PurePath Digital amplifier; bonding capability plated power metal; bridge-tied-load power stage; class D digital power amplifier; high quality music amplifier; musical signals; power audio amplifier; Audio amplifiers; BiCMOS integrated circuits; Copper alloys; Integrated circuit metallization; Nickel alloys; Palladium alloys; Power MOSFETs; Power amplifiers; Power integrated circuits;
Conference_Titel :
Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on
Print_ISBN :
4-88686-060-5
DOI :
10.1109/ISPSD.2004.1332868
