DocumentCode :
3416135
Title :
MOSFET-mode ultra-thin wafer PTIGBTs for soft switching application $theory and experiments
Author :
Nakagawa, Akio ; Matsudai, Tomoko ; Matsuda, Tadashi ; Yamaguchi, Masakazu ; Ogura, Tsuneo
Author_Institution :
Semicond. Co., Toshiba Corp., Kawasaki, Japan
fYear :
2004
fDate :
24-27 May 2004
Firstpage :
103
Lastpage :
106
Abstract :
We have previously proposed and analyzed the MOSFET-mode operation of ultra-thin wafer PTIGBTs in (T. Matsudai et. al., Proc. of ISPSD´02, p.258). The present paper, for the first time, presents an analytical theory of MOSFET-mode operation, and shows that the safe operating area is determined by a mechanism similar to the second breakdown of npn bipolar transistors. The present paper also experimentally demonstrates, for the first time, that the MOSFET-mode IGBTs are strongly effective for soft switching applications. The developed MOSFET-mode 900 V 60 A thin wafer trench gate PTIGBTs have reduced turn-off loss by 55% at 125°C, compared with the conventional (4th generation) soft switching PTIGBTs.
Keywords :
insulated gate bipolar transistors; power semiconductor switches; semiconductor device breakdown; semiconductor device measurement; semiconductor device models; 125 degC; 60 A; 900 V; MOSFET-mode IGBT; SOA mechanism; device second breakdown; safe operating area; soft switching; trench gate PTIGBT; ultra-thin wafer PTIGBT; Insulated gate bipolar transistors; Power semiconductor switches; Semiconductor device modeling;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2004. Proceedings. ISPSD '04. The 16th International Symposium on
Print_ISBN :
4-88686-060-5
Type :
conf
DOI :
10.1109/ISPSD.2004.1332871
Filename :
1332871
Link To Document :
بازگشت